Signal Integrity Challenges in Modern AI Computers: Chiplets — What / Why / Where

Judd Gerber from Intel will cover understanding why chiplets are becoming central to modern processor design, how they are partitioned, and where they fit in next-generation systems. This presentation is in association with CU Boulder’s High Speed Digital Engineering (HSD) Program. We aim to connecting students, researchers, and industry professionals through technical talks on signal integrity, packaging, PCB design, interconnects, power integrity, and modern high-performance computing.